| S130 SoftDevice v2.0.1 |

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ble_gap_sec_kdist_t Struct Reference
Structures

Keys that can be exchanged during a bonding procedure. More...

`#include <ble_gap.h>`

## Data Fields
uint8_t | enc: 1
uint8_t | id: 1
uint8_t | sign: 1
uint8_t | link: 1

## Detailed Description

Keys that can be exchanged during a bonding procedure.

## Field Documentation

uint8_t ble_gap_sec_kdist_t::enc

Long Term Key and Master Identification.

uint8_t ble_gap_sec_kdist_t::id

Identity Resolving Key and Identity Address Information.

uint8_t ble_gap_sec_kdist_t::link

Derive the Link Key from the LTK.

uint8_t ble_gap_sec_kdist_t::sign

Connection Signature Resolving Key.