<?xml version="1.0" encoding="UTF-8" ?>
<?xml-stylesheet type="text/xsl" href="https://test-devzone.nordicsemi.com/cfs-file/__key/system/syndication/rss.xsl" media="screen"?><rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:slash="http://purl.org/rss/1.0/modules/slash/" xmlns:wfw="http://wellformedweb.org/CommentAPI/" xmlns:atom="http://www.w3.org/2005/Atom"><channel><title>EMC and EMI concerns</title><link>https://test-devzone.nordicsemi.com/f/nordic-q-a/87798/emc-and-emi-concerns</link><description>I use an InsightSIP ISP1907-HT module, I have a 4 layer board to minimise cost. Signals on top and bottom with GND on inside. 
 
 I&amp;#39;m concerned that my design could fail emmissions tests because the vias on internal pads cause a hole in the GND plane</description><dc:language>en-US</dc:language><generator>Telligent Community 13 Non-Production</generator><lastBuildDate>Thu, 12 May 2022 06:21:14 GMT</lastBuildDate><atom:link rel="self" type="application/rss+xml" href="https://test-devzone.nordicsemi.com/f/nordic-q-a/87798/emc-and-emi-concerns" /><item><title>RE: EMC and EMI concerns</title><link>https://test-devzone.nordicsemi.com/thread/367516?ContentTypeID=1</link><pubDate>Thu, 12 May 2022 06:21:14 GMT</pubDate><guid isPermaLink="false">137ad170-7792-4731-bb38-c0d22fbe4515:7a5c0126-3926-4a63-b4d1-229d87e288a6</guid><dc:creator>user79391</dc:creator><description>&lt;p&gt;Looking at this again, it seems that the via-in-pad holes go all the way through the PCB, so maybe the module has a GND plane internally and all of this is fine already.&lt;/p&gt;
&lt;p&gt;Thanks for taking the time to help me, it&amp;#39;s greatly appreciated.&lt;/p&gt;
&lt;p&gt;I will contact InsightSIP again to try to get a more certain answer. (just to be safe)&lt;/p&gt;&lt;div style="clear:both;"&gt;&lt;/div&gt;</description></item><item><title>RE: EMC and EMI concerns</title><link>https://test-devzone.nordicsemi.com/thread/367425?ContentTypeID=1</link><pubDate>Wed, 11 May 2022 13:01:36 GMT</pubDate><guid isPermaLink="false">137ad170-7792-4731-bb38-c0d22fbe4515:688308fd-23cd-4c92-979b-6c47faa0ee25</guid><dc:creator>user79391</dc:creator><description>&lt;p&gt;thank you, I also looked at the same gerbers and I thought they have 2 or 3 GND&amp;nbsp;pours under the pads.&lt;/p&gt;
&lt;p&gt;&lt;/p&gt;
&lt;p&gt;&lt;img src="https://test-devzone.nordicsemi.com/resized-image/__size/320x240/__key/communityserver-discussions-components-files/4/pastedimage1652273637570v2.png" alt=" " /&gt;&lt;/p&gt;
&lt;p&gt;They also seem to use a via that&amp;nbsp;does not go through the whole board. I&amp;#39;m not sure&amp;nbsp;from these gerbers if its a 4 or 6 layer board. I never normally try to read gerber files so maybe I&amp;#39;ve made a mistake.&lt;/p&gt;
&lt;p&gt;I reached out to their contact page for support but I&amp;#39;ve not received a reply.&lt;/p&gt;
&lt;p&gt;&lt;/p&gt;&lt;div style="clear:both;"&gt;&lt;/div&gt;</description></item><item><title>RE: EMC and EMI concerns</title><link>https://test-devzone.nordicsemi.com/thread/367396?ContentTypeID=1</link><pubDate>Wed, 11 May 2022 12:02:57 GMT</pubDate><guid isPermaLink="false">137ad170-7792-4731-bb38-c0d22fbe4515:d130ff8f-fee7-4d28-8a51-34028a913f30</guid><dc:creator>user77059</dc:creator><description>&lt;p&gt;Hi Jason,&lt;br /&gt;&lt;br /&gt;as far as I can see they don&amp;#39;t have any ground between the bads in their reference design/DK:&lt;br /&gt;&lt;img src="https://test-devzone.nordicsemi.com/resized-image/__size/320x240/__key/communityserver-discussions-components-files/4/pastedimage1652270487315v1.png" alt=" " /&gt;&lt;br /&gt;&lt;br /&gt;&lt;a href="https://www.insightsip.com/fichiers_insightsip/pdf/ble/ISP1907/ISP1907_HT_TB_Gerber.zip"&gt;Gerber files, DK&lt;/a&gt;&lt;br /&gt;&lt;br /&gt;So what you have done looks okay, based on their reference.&lt;br /&gt;&lt;br /&gt;Best regards,&lt;br /&gt;Kaja&lt;/p&gt;&lt;div style="clear:both;"&gt;&lt;/div&gt;</description></item></channel></rss>