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Nordic Case Info

Case ID: 287868

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Recommended Footprint nRF9160

user114942 over 4 years ago

Hi,

The Evaluation board seems to have a footprint for nRF9160 non conventional.

The middle on TopLayer is a sort of Grid connected to the GND and Track to link Vias t Inner GND Plane.

Is this sort of connection recommended for some reason? We thought to fill a classic GND plane and Vias (not in pad , so covered by solder mask)

Can this have some impact on soldering or can have some other impacts on performances?

Best Regards,

Luca

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0 ketiljo over 4 years ago

There's no other reason for the grind under the module than to improve solderability as a ground plane may take more time to heat properly. If you solder process allows for it, is should be ok.

The aperture for the paste stencil may need reduction, depending on the thickness of the stencil and the process.
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0 ketiljo over 4 years ago

There's no other reason for the grind under the module than to improve solderability as a ground plane may take more time to heat properly. If you solder process allows for it, is should be ok.

The aperture for the paste stencil may need reduction, depending on the thickness of the stencil and the process.
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