I use an InsightSIP ISP1907-HT module, I have a 4 layer board to minimise cost. Signals on top and bottom with GND on inside.

I'm concerned that my design could fail emmissions tests because the vias on internal pads cause a hole in the GND plane below the processor.
There is also nowhere to place GND return vias beside the signal vias in this area.
The pads are connected to LEDs and I use PWM to vary the illumination. I have a small decoupling cap on each LED.
The ISP1907-HT datasheet does not offer any advice on board stackup or methods to connect these pads.

